Indium Launches Water

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Indium Corporation has released Indium6.6HF Solder Paste—a new water-soluble solder paste that is compatible with both SnPb and Pb-free alloys. Indium6.6HF is designed to provide exceptional stencil printing performance and minimize voiding in PCB assembly applications.

Indium6.6HF exhibits superior wetting to a variety of surface finishes resulting in the fewest voids, a reduction in the size of the largest voids, and minimized overall voiding.

Other Indium6.6HF benefits include:

- Halogen-free per IEC 61249-2-21 test method EN14582

- Exceptional printing process window:

- High tack value (>8 hours) ensures consistent component holding power, allowing high-speed component placement operation

- Cleanable up to at least 72 hours after reflow

About Indium Corporation

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.