MSI showcases 4

The Taiwanese company is aiming to fit even more powerful graphics processing units.

MSI Next-Gen Cooler concept, Source: MSI Japan

MSI has showcased three cooling solution concepts at Computex: a bimetallic fin array, 3D vapor chamber and an integrated AIO cooler. The first design (shown above) is an idea of mixing copper and aluminum fins to increase heat dissipation on the same cooling area. The technology is taking advantage of the different thermal conductivity of copper and aluminum. This prototype cooler is currently not planned for any specific GPU model. However, the demo card is RTX 4090 SUPRIM X (same PCB and I/O bracket), which leads us to believe that such a cooler might be used for RTX 4090 Ti later.

The company is also revealing its DynaVC technology, which is basically a vapor chamber with foldable heatpipes. This design eliminates the issue of soldering heatpipes with vapor chamber and increases the thermal conductivity and heat transfer in the process.

MSI Next-Gen Cooler concept, Source: Benchlife/Wccftech

The third and final concept design shown at Computex is a FusionChill cooler. This concept is similar to Acer's Predator design with an integrated AIO (All-In-One) liquid cooler into the GPU. MSI's concept is a slightly less elegant solution with tubes still in the design. Still, the company is proposing an innovation of adding copper fins on the base, which could further improve cooling efficiency directly through the plate.

MSI Next-Gen Cooler concept, Source: Benchlife

MSI confirms that this type of cooling design has a 10% larger radiator than the standard 240mm design and fits 15% more water volume. Clearly, the only real issue will be the thickness of this cooler.

Source: MSI Japan, Wccftech, Benchlife